Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

Abstract: Ionic residues resulting from the soldering process is an important parameter in connection with humidity robustness of Printed Circuit Board Assemblies (PCBAs) due to their ability to ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

Materials specialist Junkosha unveiled its cut-to-length and slit peelable heat-shrink tubing technology at MD&M West last week in Anaheim, CA. The product is designed to streamline medical ...

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing ...

With nitrogen generators, companies can ensure a more stable, repeatable process that increases product reliability and overall yield. The trend toward miniaturisation, particularly in sectors such as ...

ABSTRACT: Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to ...

Nippon Chemi-Con’s patented capacitor design aims to reduce mounting failures during solder reflow by incorporating a unique structure with a sealed outer case, lead terminal, and convex portion. The ...

KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

The Reflow Shuttle O2 measurement module represents a major leap forward in the quest for precise reflow soldering control. Oxygen (O2) measurement is crucial because it can affect the solder joint ...