Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of ...
Breakthroughs, discoveries, and DIY tips sent every weekday. Terms of Service and Privacy Policy. Since 3D printers debuted in the 1980s, the devices have been used ...
DroneScan3D attached to a drone, which is not included with the instrument. As more tower sites adopt drones for maintenance tasks, one amateur radio operator has designed a field strength instrument ...
Have you ever imagined turning your ideas into physical objects with just a few clicks? Thanks to tools like Tinkercad, what once seemed like science fiction is now an accessible reality for anyone ...
This is an advanced 3D tutorial. Hopefully you have seen my previous Unity 3D tutorial or are fairly familiar with Unity 3D because I am assuming you are aware of familiar Unity 3D concepts. In ...
In this post, we are going to discuss the best free 3D file viewer software for Windows 11/10. Using these free software, you can easily view a variety of 3D files. Some of the commonly supported 3D ...
In this blog, we will discuss how Keysight RF Circuit Simulation Professional revamps RF circuit simulation and optimization. Discover how to achieve efficient, accurate designs for even the most ...
In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution – tackling one of the ...
Researchers have found a way to produce far smaller 3D-printed RF components. Currently, there are limitations in 3D printing vertical structures with high aspect ratios. This geometry is often used ...
Researchers developed a hybrid method to build precise 3D RF microstructures, boosting performance, tunability, and cutting device size by up to 45%. (Nanowerk News) In a leap forward for miniaturized ...
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