MICROIP (Taiwan OTC: 7796), a provider of specialized ASIC design services and AI solutions, today announced the ...

Alibaba is undergoing a significant strategic realignment, placing artificial intelligence at the very core of its ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

In 2025, enterprises are dealing with increasingly complex digital ecosystems, spanning cloud-native applications, AI models, IoT devices, and microservices that must work together seamlessly. As ...

Sweeping transformation across the armed forces has been a top priority of 2025, with the U.S. Army Communications-Electronics Command rapidly ...

The GCE Advanced Level in Sri Lanka is the national qualification examination that determines university admission for students who complete Grade 13. Students must select three subjects from one of ...

Lockheed Martin has opened a new Hypersonics System Integration Lab (SIL) at its Huntsville, Alabama, campus, a 17,000-square-foot (around 1,600 square meters) facility built to accelerate system ...

Optical metasurfaces, with their ultra-thin and lightweight properties, are driving the miniaturization and planarization of optical systems. However, their development from unit-cell design to system ...

Whoop has officially announced that Advanced Labs, its service that integrates blood biomarker testing directly into the platform, is now live in the United States. When we first analyzed the service ...

1 College of Geography and Environmental Sciences, Hainan Normal University, Haikou, China 2 School of Public Administration and Law, Hunan Agricultural University, Changsha, China Comprehensively ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...