Abstract: A finite-element analysis model of ball grid array (BGA) solder joints for microfluidic ceramic substrates was established, and fluid-structure-coupled finite-element simulation analysis was ...
Abstract: In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder ...
Receiving, processing, manufacturing and distributing dairy and other food-related products.
Customer stories Events & webinars Ebooks & reports Business insights GitHub Skills ...
Customer stories Events & webinars Ebooks & reports Business insights GitHub Skills ...
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