Abstract: At the CdTe/CdS interface, a significant Te-S interdiffusion has been found a few nanometers into the CdTe grain interiors with scanning transmission electron microscopy (STEM) and electron ...
Abstract: The rapid diffusion of Ag–Au usually results in weak interface joints, which significantly impacts the stability of wide bandgap (WBG) devices. Therefore, the interdiffusion mechanism at the ...
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