A line scan camera from Teledyne Dalsa provides spectrally independent RGB and NIR outputs to detect defects on and under the surface. The Linea ML 8k multispectral camera can be used for examining a ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...
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