The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...

OK International claims that by integrating a number of rework technologies, the MRS-1000 modular system broadens application possibilities and enhances productivity. Intended for the removal and ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Package-on-package (PoP) assembly is a quickly evolving 3D packaging trend (or, to be more politically correct, "technique") that meets today's demand for lighter, faster and miniaturized electronics, ...