As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...
Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...
As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The ...
The integration of data from many sources, especially new 'omic' platforms, is increasingly challenging not just because of increasing volume of data but because these data are highly diverse, ...
In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.
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